Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Toshiba Photorelays Push Switching Reliability to 135°C
Toshiba introduces compact S-VSON4T photorelays rated for 135°C operation with integrated input resistors, designed for automated test equipment, probe cards, and burn-in systems.
Read MoreSTMicroelectronics Scales Silicon Photonics for AI Interconnects
STMicroelectronics moves its PIC100 silicon photonics platform into high-volume 300 mm production for 800G and 1.6T optical interconnects supporting AI data center infrastructure.
Read MoreMicrochip LX4580 Mixed-Signal IC for Actuation Systems
Microchip’s LX4580 is a 24 channel mixed signal IC designed for aviation and defense actuation systems, integrating sensor interfaces, motor control outputs, and high speed ADCs in a single device.
Read MoreAbracon AANI-CH-0080 Chip Antenna Targets Wi-Fi 6E/7 Bands
Abracon’s AANI-CH-0080 ceramic chip antenna supports tri band Wi-Fi operation across 2.4 GHz, 5 GHz, and 6 GHz, enabling compact embedded designs for Wi-Fi 6E and Wi-Fi 7 devices.
Read MoreJapan To Extract Rare Earth Minerals From Old Motors To Fight China
Japan is turning to recycling old motors and printed circuit boards to secure rare earth minerals like neodymium, reduce reliance on China, and strengthen its supply chain amid rising geopolitical and industrial risks.
Read MoreKontron OSM-S AM62L Brings TI Processing Into Compact Modules
Kontron’s OSM-S AM62L module brings a dual core Texas Instruments AM62L processor, scalable LPDDR4 and eMMC, dual GbE and CAN FD, and full OSM compatibility to compact embedded systems used in energy, medical, industrial and building automation designs.
Read MoreDiodes MXQ Spread Spectrum Oscillators Reduce EMI In Automotive Clocking
Diodes Incorporated’s MXQ spread spectrum oscillators reshape clock energy to reduce EMI in automotive and connected driving systems, offering multiple package sizes, programmable frequencies and stable jitter behavior for dense electronic designs.
Read MoreBourns RF Inductors Push High Frequency Stability Into Smaller Footprints
Bourns has introduced new multilayer chip inductors in compact case sizes with high SRF performance for RF amplifiers, wireless modules, radar, and communication systems, offering stable high frequency behavior with monolithic construction.
Read MoreKeysight XR8 Scope Architecture Pushes High Speed Validation Forward
Keysight’s Infiniium XR8 oscilloscope introduces a new front end with integrated ADC and DSP processing, reducing noise, accelerating compliance testing, and improving workflow efficiency for high speed digital validation.
Read MoreResearchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives
Despite the rise of SSDs, hard disk drives remain critical for large-scale and cost-effective data storage. This article explores HDD evolution, mechanical limitations, breakthroughs like the 0.8nm MAC protective layer, and why HDDs will continue to dominate archival, cloud, and high-density storage applications.
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