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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Bourns SE Series Mini-Breakers Add 240 W USB-C Safety
Bourns SE Series miniature Thermal Cutoff devices provide connector-level overtemperature protection for 240 W USB Power Delivery systems in a compact surface-mount form.
Read MoreSK hynix Brings New Heat Dissipation Technology to Mobile DRAM
SK hynix begins shipping mobile DRAM with High-K EMC, improving thermal conductivity 3.5× and reducing resistance to tackle AI smartphone heat issues.
Read MoreSK hynix Mass Produces 321-Layer QLC NAND for AI Storage
SK hynix launches mass production of 321-layer QLC NAND, doubling capacity and boosting performance for AI servers and enterprise SSDs.
Read MoreToshiba Shrinks Automotive Photorelay for High-Voltage Battery Systems
Toshiba’s TLX9161T photorelay offers 1500V withstand voltage in a smaller SO12L-T package, helping engineers design safer, more compact EV battery systems.
Read MoreVishay TSM41 Trimmer Delivers Precision in a Compact, Sealed Package
Vishay’s TSM41 multi-turn SMD trimmer offers fine adjustment, IP67 sealing, and a wide temperature range for reliable performance in harsh, space-limited designs.
Read MoreDiodes Rolls Out Compact HDMI 2.1 ReDrivers with 8K and DDC Listener
Diodes launches the PI3HDX12311 and PI3HDX6311 HDMI ReDrivers for 8K video, with DDC Listener, trace cancellation, and compact footprint.
Read MoreJAE’s New Vertical USB Type-C Connector Simplifies Assembly and Increases Reliability
JAE’s new vertical USB Type-C connector improves plug alignment, supports USB 3.2 and 240W PD, and is ideal for internal device applications.
Read MoreKYOCERA AVX Launches Compact SPE Connectors for Industrial Ethernet Networks
KYOCERA AVX launches compact Single-Pair Ethernet (SPE) connectors to simplify industrial networks and save board space.
Read MoreRohde & Schwarz and Qualcomm Test NG eCall Ahead of 2026 EU Rollout
With EU regulations shifting, Rohde & Schwarz and Qualcomm validate NG eCall over 5G using the Snapdragon Auto platform and CMX500 tester.
Read MoreTDK Launches edgeRX Vision for High-Speed AI Defect Detection at the Edge
Meta Description: TDK introduces edgeRX Vision, an AI-powered defect detection system capable of inspecting 2,000 parts per minute with sub-millimetre precision.
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