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Littelfuse Expands Magnetic Sensing with High-Precision TMR Angle Sensors

LF53466 and LF53464 TMR angle sensors deliver 0–360° measurement, low error rates, and high stability for automotive, industrial, and consumer applications.

littelfuse, tmr, angle sensor, magnetic sensing, rotary encoder, position sensing, automotive sensor, industrial automation, consumer electronics

TDK ICM‑536xx Brings High‑Performance OIS to Mainstream Devices

TDK’s new ICM‑536xx IMU delivers high‑performance optical image stabilization for smartphones, tablets, and cameras in a compact, low‑power MEMS package.

tdk, invensense, imu, mems, ois, image stabilization, motion sensors, mobile devices, smartphones, consumer electronics, sensors, cameras, tablets

Nexperia Launches 1V ESD Protection Diodes for USB4 and Thunderbolt Interfaces

Nexperia’s new ESD diodes safeguard USB4 and Thunderbolt lines with ultra-low capacitance, high surge handling, and minimal signal loss at 10 GHz+.

nexperia, esd protection, usb4, thunderbolt, rf design, surge protection, signal integrity, diodes, semiconductors, high-speed interfaces

Navitas Introduces Isolated TO-247 Package for SiC MOSFETs

Navitas has launched the UHV-TO-247-4-ISO package for 1200 V, 2300 V, and 3300 V GeneSiC MOSFETs. The package combines integrated 6000 V isolation with direct-cooled thermal management, reducing thermal resistance by up to 60% and increasing power dissipation capability by up to 150%.

Navitas, GeneSiC, SiC MOSFET, Silicon Carbide, TO-247, UHV-TO-247-4-ISO, Power Electronics, Battery Energy Storage, Solid State Transformer, Renewable Energy, Power Conversion System, Thermal Management, High Voltage Isolation, AI Datacenter Power, AMB Substrate, Aluminum Nitride

Texas Instruments Adds EIS Technology to 26-Cell Battery Monitor

Texas Instruments has introduced the BQ79826Z-Q1 battery monitor with an integrated EIS engine and support for up to 26 series-connected cells. The device delivers less than 2 mV voltage accuracy, supports ASIL-D functional safety requirements, and targets EV and energy storage battery management systems.

Texas Instruments, TI, BQ79826Z-Q1, Battery Monitor, Battery Management System, BMS, EIS, Electrochemical Impedance Spectroscopy, EV Battery, Energy Storage System, ASIL-D, ISO 26262, Battery Diagnostics, Cell Monitoring, State of Health, State of Charge, Automotive Electronics

Melexis Introduces MLX92344 Hall Switch with Four Output States Over Two Wires

Melexis has introduced the MLX92344 automotive Hall switch. The device supports up to four output states over a two-wire interface, programmable current outputs from 3mA to 28mA, and operation from -40°C to +150°C.

Melexis, MLX92344, Hall Sensor, Hall Switch, Position Sensor, Automotive Electronics, Magnetic Sensor, Contactless Sensing, Seat Position Sensor, E-Latch, Charge Port, AEC-Q100, ASIL B, Body Electronics, Steering Column, Automotive Sensor, Sensors

Toshiba Adds Complementary Dual MOSFET For Motor Control And Load Switching

Toshiba has introduced the SSM6L826R, a 30 V complementary dual MOSFET that combines N-channel and P-channel devices in a TSOP6F package for motor control and load-switching applications in consumer and industrial equipment.

Toshiba, SSM6L826R, MOSFET, Dual MOSFET, Complementary MOSFET, N-Channel MOSFET, P-Channel MOSFET, TSOP6F, BLDC Motor Control, Brushed DC Motor, Load Switch, Power Switching, Industrial Control, Consumer Electronics, UMOSVIIH, UMOSVI, 30V MOSFET, Motor Driver, Power Management, Discrete Semiconductor

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

SK hynix, iHBM, HBM, HBM5, AI memory, high bandwidth memory, thermal management, AI accelerator, GPU memory, HPC, data center, semiconductor packaging, MR-MUF, wafer level packaging, memory cooling, D2D PHY, AI infrastructure, advanced packaging, memory technology

u-blox ZED-X20P GNSS Module Adds Global PPP Support

u-blox ZED-X20P-01B GNSS module enables decimeter-level positioning using global PPP and Galileo HAS, reducing reliance on RTK infrastructure.

u-blox, ZED-X20P-01B, ZED-X20P, GNSS, GNSS module, Galileo HAS, PPP, Precise Point Positioning, decimeter accuracy, RTK alternative, PointPerfect, Moving Base, UAV navigation, robotics, autonomous systems, marine positioning, precision agriculture, construction equipment, mining, environmental mapping, spoofing detection, jamming mitigation

DigiKey and Microchip Webinar Covers CircuitPython vs Verilog

DigiKey and Microchip will host a free April 30 webinar covering CircuitPython and Verilog, showing how embedded systems combine software and hardware logic.

DigiKey, Microchip, Embedded Systems, CircuitPython, Verilog, FPGA, Microcontrollers, Embedded Programming, Digital Logic, Hardware Design, Software Development, Engineering Education, veryVERILOG, FPGA Kit, Prototyping, Electronics Training

Littelfuse Expands Magnetic Sensing with High-Precision TMR Angle Sensors

TDK ICM‑536xx Brings High‑Performance OIS to Mainstream Devices

Nexperia Launches 1V ESD Protection Diodes for USB4 and Thunderbolt Interfaces

Navitas Introduces Isolated TO-247 Package for SiC MOSFETs

Texas Instruments Adds EIS Technology to 26-Cell Battery Monitor

Melexis Introduces MLX92344 Hall Switch with Four Output States Over Two Wires

Toshiba Adds Complementary Dual MOSFET For Motor Control And Load Switching

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

u-blox ZED-X20P GNSS Module Adds Global PPP Support

DigiKey and Microchip Webinar Covers CircuitPython vs Verilog

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