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Qorvo Expands RF Switching Portfolio With Wideband 10 GHz Family

Qorvo has introduced the QPC6144, QPC6122, and QPC6188 RF switches, delivering wideband operation from 50 MHz to 10 GHz with high isolation and simplified RF routing for 5G, industrial, drone, and test systems.

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Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

Microchip has introduced 3.3 kV HV-D3 mSiC power modules for solid-state transformers, combining SiC MOSFETs, Schottky diodes, and high-voltage isolation for AI data centers and medium-voltage power systems.

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u-blox Adds Edge ML To ALMA-B2 Bluetooth LE Modules

u-blox has launched the ALMA-B2 wireless module series based on Nordic Semiconductor’s nRF54LM20 platform, combining Bluetooth LE 6.0, Thread, Zigbee, Channel Sounding, and Edge ML acceleration in compact IoT modules.

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ST Expands 700V PowerGaN Devices For AI And Robotics

STMicroelectronics has added seven 700V PowerGaN HEMTs to its STPOWER portfolio, targeting AI servers, robotics, industrial power systems, and high-density power conversion designs with current ratings up to 29 A.

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Würth Elektronik Adds I²C Digital Isolators For Signal Isolation

Würth Elektronik has introduced the WPME-CDI2C family of 2-channel digital isolators for I²C interfaces, supporting bidirectional data transmission up to 2 MHz, 3750 VRMS isolation, and ±150 kV/µs CMTI.

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TDK DC-DC Converters Remove External Power Design

TDK-Lambda CCGS DC-DC converters deliver 15 W and 30 W isolated power with no external components, reducing design complexity in industrial and automation systems.

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binder M12 Connectors Add Tool-Friendly Coupling Rings

binder updates moulded, shielded M12 connectors with knurled and hexagonal coupling rings for tool-assisted assembly, controlled torque, and more consistent industrial installation.

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Littelfuse TDB Series Brings DIP Switching to Tight SMT Layouts

Littelfuse and C&K’s TDB Series brings half-pitch SMT DIP switching to compact PCB designs, combining smaller footprints, sealed washable construction, and reliable low-power contact performance for industrial, power, security, and embedded systems.

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Toshiba 40V MOSFET Cuts Losses In Power Supplies

Toshiba has introduced the 40V TPHR6704RL power MOSFET using its U-MOS11-H process, combining ultra-low on-resistance, improved figure of merit, and lower switching spike behavior for data center and industrial power supply designs.

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China Semiconductor Capacity Share To Hit 32% By 2030

As the semiconductor industry ramps up production, it is estimated that China could snatch up 32% of the global market. What has China done over the years, where does this figure come from, and could it be right?

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