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SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing

Marvell Validates Structera CXL Across CPUs and Memory Suppliers

Marvell’s Structera CXL controllers are now validated across AMD, Intel, Micron, Samsung, and SK hynix, a milestone for AI and data-centre memory.

marvell, cxl, compute express link, structera, amd, intel, micron, samsung, sk hynix, ddr5, ddr4, ai, data centres, memory expansion

SK hynix Brings New Heat Dissipation Technology to Mobile DRAM

SK hynix begins shipping mobile DRAM with High-K EMC, improving thermal conductivity 3.5× and reducing resistance to tackle AI smartphone heat issues.

sk hynix, dram, mobile memory, high-k emc, ai smartphones, heat dissipation, package on package, pop, memory packaging, thermal management, materials innovation

SK hynix Mass Produces 321-Layer QLC NAND for AI Storage

SK hynix launches mass production of 321-layer QLC NAND, doubling capacity and boosting performance for AI servers and enterprise SSDs.

sk hynix, nand flash, qlc, memory, ssd, enterprise ssd, essd, pc ssd, ai servers, storage, semiconductors

SK hynix Completes HBM4 Development and Prepares for Mass Production

Marvell Validates Structera CXL Across CPUs and Memory Suppliers

SK hynix Brings New Heat Dissipation Technology to Mobile DRAM

SK hynix Mass Produces 321-Layer QLC NAND for AI Storage

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