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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Nexperia 100 V CCPAK1212 MOSFETs Target 48 V Automotive Power Systems

Nexperia’s CCPAK1212 MOSFETs combine 0.99 mΩ RDS(on), 460 A current capability, and copper-clip packaging to shrink PCB space and boost efficiency.

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Rohde & Schwarz Extends ZNB3000 Vector Network Analyzer Range to 54 GHz

The R&S ZNB3000 now covers up to 54 GHz, enabling PCIe 7.0, 50 GHz Ethernet, 6G, and SatCom testing with industry-leading speed and dynamic range.

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TDK-Lambda Adds 1200 W Models to CUS-M AC-DC Power Supply Series

TDK-Lambda’s CUS1200M brings 1200 W of medical- and industrial-rated AC-DC power in a compact 187 × 93 mm footprint with 30 dBA acoustic noise.

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Digi XBee® 3 BLU Brings BLE 5.4, Edge Intelligence, and Security in One Module

Digi’s XBee 3 BLU combines Bluetooth LE 5.4, edge processing, TrustFence security, and mobile provisioning tools to speed IoT development.

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Bel Fuse Expands Titanium-Efficiency CRPS Lineup With TEC2700 and TEC3200

Bel Fuse’s new TEC2700 (2.7 kW) and TEC3200 (3.2 kW) CRPS front-end power supplies deliver up to 96 % efficiency, N+1 redundancy, and flexible airflow for data center and networking designs

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Vishay Launches First Automotive Y1-Rated Ceramic Capacitors in SMD Package

Vishay’s SMDY1 Automotive Series are the first Y1-rated ceramic capacitors in SMD format, combining 500 VAC rating, 4.7 nF capacitance, and Class IIB humidity grade for EV power systems.

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ABLIC S-57W1/W2 Dual Hall ICs Simplify Motor Feedback in Space-Constrained Designs

ABLIC’s S-57W1/W2 integrates two Hall elements in one IC, giving engineers high-resolution speed and direction feedback without using two sensors.

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TDK Introduces SmartMotion ICM-45685 IMU for Next-Generation Smart Glasses

TDK’s new ICM-45685 SmartMotion IMU delivers precise head tracking, OIS/EIS, and activity recognition for AR and AI glasses at ultra-low power.

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Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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Renesas Adds Capacitive Touch to Its Smallest, Lowest-Power RA0 MCUs

Renesas expands its RA0 MCU line with the RA0L1 series, adding built-in capacitive touch, ultra-low-power operation, and fast wake-up for cost-sensitive consumer, industrial, and battery-powered applications.

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