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Infineon’s 1ED301xMC12I Drivers Ease The Shift Toward High Speed SiC Switching

Infineon’s 1ED301xMC12I isolated gate drivers offer opto compatible inputs, 300 kV per microsecond CMTI and precise timing for SiC MOSFETs, enabling faster switching and reliable isolation in motor drives, EV chargers and renewable energy systems.

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Amphenol TS1 Connectors Handle High Power in Harsh Systems

Amphenol TS1 power connectors deliver high voltage and high current performance with EMI shielding for harsh industrial and energy systems.

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SemiQ Gen3 SiC Modules Push Current Density for High Power Systems

New SiC power modules offer high current capability and low thermal resistance for EV and industrial systems.

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onsemi Introduces Top Cool SiC Packaging for High Power Designs

onsemi adds a top cool T2PAK package to its EliteSiC MOSFETs, improving thermal performance and power density for EV and industrial designs.

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Littelfuse 200 V X4-Class MOSFET Targets High-Current Power Systems

The Littelfuse MMIX1T500N20X4 delivers 200 V and 480 A performance with topside cooling for compact high current power systems.

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SemiQ Expands 1200 V Gen3 SiC MOSFET Line with New SOT-227 Modules

SemiQ has released new 1200 V Gen3 SiC MOSFET SOT-227 modules with 7.4, 14.5 and 34 mΩ options for chargers, solar inverters and high-power systems.

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onsemi Introduces Vertical GaN Semiconductors for High-Density Power Systems

onsemi introduces vertical GaN-on-GaN power semiconductors with 700 V and 1,200 V capability, cutting switching losses and boosting power density for AI and EV systems.

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NXP Integrates EIS into Battery Management Chipset for Real-Time Health Diagnostics

NXP’s new BMS chipset performs hardware-based Electrochemical Impedance Spectroscopy to improve battery health insight and fast-charging safety.

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Infineon Raises the Bar in Coreless Current Sensing with New XENSIV Devices

Infineon’s new TLE4971 and TLI4971 sensors achieve 0.7 percent total error, providing high-precision, coreless current measurement for automotive and industrial power systems.

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Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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