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Toshiba 600 V Super Junction MOSFET Targets High-Density Power Systems

Toshiba’s TK057V60Z brings lower loss and a compact DFN8×8 package to 600 V power supplies used in data centres, UPS systems and solar equipment.

toshiba, tk057v60z, dtmosvi, super junction mosfet, 600 v mosfet, dfn8×8, kelvin source, power supplies, ups, data centre, photovoltaic, switching efficiency

Infineon's HYPERRAM Validated on AMD Spartan FPGA for Low Pin Designs

Infineon HYPERRAM and controller IP are now tested on the AMD Spartan SCU35 FPGA to enable low pin external memory for MicroBlaze V designs.

infineon, hyperram, hyperbus, amd spartan ultrascale plus, scu35, external memory, microblaze v, risc v, low pin interface, fpga design

STMicroelectronics NFC Chip Simplifies Matter Device Onboarding

ST’s ST25DA C enables secure tap based onboarding for Matter 1.5 devices using energy harvesting to support power free commissioning.

stmicroelectronics, st25da c, matter 1.5, nfc commissioning, secure element, type 4 tag, smart home, iot onboarding, energy harvesting

ROHM 100 V MOSFET Supports 48 V AI Server Hot-Swap in 5×6 mm Package

ROHM’s RS7P200BM provides wide SOA and low RDSon in a compact 5×6 mm package for 48 V AI server and industrial power protection.

rohm, rs7p200bm, 100 v mosfet, wide soa, 48 v hot swap, dfn5060, data centre power, ai servers, industrial power, battery protection

Littelfuse 200 V X4-Class MOSFET Targets High-Current Power Systems

The Littelfuse MMIX1T500N20X4 delivers 200 V and 480 A performance with topside cooling for compact high current power systems.

littelfuse, mmix1t500n20x4, x4 class mosfet, 200 v mosfet, 480 a current, smpd x package, topside cooling, power density, energy storage, industrial charging

AMD MI300X Enables Large-Scale MoE Training for Zyphra

Zyphra trains its ZAYA1 MoE model on AMD MI300X GPUs without sharding, using 192 GB memory and faster I O to simplify large scale AI training.

amd, zyphra, mi300x, zaya1, moe model, high bandwidth memory, ai training, gpu architecture, rocm, pensando networking, ibm cloud

ABLIC S-19560B PMIC Reduces Camera Module Power Footprint

ABLIC’s S-19560B PMIC integrates three power rails in a compact package to shrink automotive camera modules and improve thermal efficiency.

ablic, s-19560b, pmic, camera module power, automotive cameras, adas, dms, power sequencing, hsnt-8 package, high-psrr ldo, multi-rail supply, thermal design

iDEAL SuperQ MOSFET Raises Safety Margin For High Voltage Batteries

iDEAL’s SuperQ MOSFET boosts short circuit robustness and reduces parallel device count in high voltage battery systems.

ideal semiconductor, superq, mosfet, bms, short circuit withstand capability, scwc, high voltage battery, 72v systems, 144v systems, rdson, toll package, power devices, battery safety, e mobility, drones, power tools

ST Introduces GaNSPIN Drivers to Bring GaN Efficiency to Motor Control

ST’s GaNSPIN GaN drivers bring wide-bandgap efficiency to BLDC motor control in appliances and industrial systems with integrated protection and tunable switching.

stmicroelectronics, ganspin611, ganspin612, gan motor drivers, bldc control, wide-bandgap, motion control, motor efficiency, appliances, factory automation, power electronics, emi control, integrated drivers

TDK Hybrid GDT MOV Design Improves Surge Protection

TDK’s hybrid MOV GDT devices reduce leakage and improve surge robustness for AC mains protection.

tdk, g series, g14, g20, mov, gdt, surge protection, transient protection, ac mains, power supplies, appliances, smart metering, industrial drives

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