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Filtering by tag: "thermal design"
Clear tag filterABLIC S-19560B PMIC Reduces Camera Module Power Footprint
ABLIC’s S-19560B PMIC integrates three power rails in a compact package to shrink automotive camera modules and improve thermal efficiency.
Read MoreEPC Unveils 5 kW GaN AC DC System for AI and Data Center Racks
EPC demonstrates a 5 kW GaN AC DC reference design improving efficiency and power density for AI servers and data center racks.
Read MoreBourns Announces High-Heat Thick Film Resistor Series
Bourns unveils the PF2270 resistor series in a compact TO-227 package, supporting up to 300W power dissipation and high-temperature operation.
Read MoreEPC 180 W GaN Buck Converter Evaluation Board for USB Power Delivery Applications
EPC has launched the EPC91109, a 180 W GaN-based buck converter evaluation board for USB-PD 3.1 applications. Featuring EPC2057 GaN FETs and the LTC7890 controller, it delivers up to 14.3 A with over 98% efficiency—all in a compact 24 mm x 24 mm footprint without a heatsink or airflow. Ideal for laptops and portable systems, the board demonstrates GaN’s potential to replace silicon in high-power, space-constrained designs.
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