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Does China’s Zombie Fabs Threaten Its Semiconductor Capabilities?

China’s semiconductor ambitions have faced billions in wasted investment and a trail of abandoned fabs, challenging its drive for self-reliance. But are these costly setbacks merely growing pains on the path to true technological independence, or signs of deeper struggles ahead?

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China US Tariffs – China Changes Definition of Origin to hurt US suppliers

China’s new chip-origin rules target U.S. semiconductor exports by basing import duties on wafer fabrication location, undermining American chipmakers’ access to the Chinese market. While the U.S. scrambles with reactive policy, China’s long-term semiconductor strategy is paying off—posing serious challenges for American suppliers and exposing flaws in short-sighted trade war tactics.

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Rapidus May Have Surpassed Intel 18A Logic Density

As semiconductor nodes shrink to 2nm and beyond, does smaller always mean better? Can raw logic density now define performance more than transistor size? And as companies like Rapidus challenge Intel and TSMC, who will ultimately produce the most cost-effective, reliable devices for modern applications?

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Intel Breaking the 2nm Barrier with Panther Lake on 18A Process

As the semiconductor industry pushes beyond 2nm toward angstrom-class technologies, manufacturing faces extreme physical, economic, and scientific limits. This article explores sub-2nm scaling challenges, quantum effects, EUV and high-NA lithography costs, Intel’s 18A Panther Lake ambitions, foundry expansion in the US, and why future progress may rely on chiplets, 3D packaging, and new integration strategies rather than simple transistor shrinking.

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Navitas Introduces 3300 V and 2300 V UHV SiC Platform For Demanding Power Systems

Navitas adds 3300 V and 2300 V SiC devices with advanced field control and robust packaging for demanding high voltage power systems.

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Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

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Microchip’s 3 nm PCIe Gen 6 Switch Targets AI Data Flow Bottlenecks

Microchip’s Switchtec Gen 6 PCIe switches improve bandwidth and latency in AI and HPC systems with 3 nm design, 160 lanes, and secure boot features.

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Renesas Expands Magnet-Free Inductive Position Sensor Line for Automation and Robotics

Renesas’ new inductive position sensors provide accurate, magnet-free motion feedback for robotics and automation, supported by an online coil design tool.

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Renesas Powers 800V Direct Current Architecture for AI Data Centres

Renesas’ GaN FETs and power semiconductors enable efficient 800V DC distribution in AI data centres, improving power density and reducing energy losses.

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Navitas Expands GaN and SiC Power Devices for 800 V AI Data Centres

Navitas extends its GaNFast and GeneSiC semiconductor portfolio to support NVIDIA’s 800 V AI data-centre architecture with higher efficiency and density.

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