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Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

Nisshinbo Silicon Motherboard 3D integration technology combines ICs, wafer-formed elements and external passive components, reducing mounting footprint by about 80% in a window comparator prototype.

Nisshinbo, Nisshinbo Micro Devices, Silicon Motherboard, Si-MB, semiconductor packaging, 3D integration, 3D packaging, silicon substrate, chiplet, chiplets, heterogeneous integration, IC packaging, passive components, analog IC, comparator, window comparator, wafer processing, system integration, miniaturization, electronic components, resistors, capacitors, inductors, automotive electronics, industrial electronics

Bourns Announces High-Heat Thick Film Resistor Series

Bourns unveils the PF2270 resistor series in a compact TO-227 package, supporting up to 300W power dissipation and high-temperature operation.

Bourns, resistors, thick film, power electronics, energy storage, battery systems, industrial, motor drives, thermal design, high power, TO 227, components

Nisshinbo Silicon Motherboard Cuts Mounting Footprint by 80%

Bourns Announces High-Heat Thick Film Resistor Series

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