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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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Renesas Adds Capacitive Touch to Its Smallest, Lowest-Power RA0 MCUs

Renesas expands its RA0 MCU line with the RA0L1 series, adding built-in capacitive touch, ultra-low-power operation, and fast wake-up for cost-sensitive consumer, industrial, and battery-powered applications.

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TI Expands C2000 MCU Line for High-Performance, Low-Cost Motor Control

Texas Instruments’ new F28E12x MCUs deliver 30% more processing power, integrated analog, and advanced FOC features for smoother, quieter, and more efficient motor control in appliances and power tools.

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Infineon Adds High-SNR, Low-Power MEMS Microphones to XENSIV Lineup

Infineon’s IM72D128V and IM69D129F combine IP57 durability, low power draw, and precise digital audio for next-generation portable devices.

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NOVOSENSE NSUC1612 Motor Driver SoC Simplifies Automotive Actuator Design

NOVOSENSE’s NSUC1612 integrates MCU, drivers, and comms in one chip, cutting cost and complexity for next-generation automotive actuators.

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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

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Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

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Infineon Unveils 12 kW High-Density PSU Reference Design for AI Data Centers

Infineon’s 12 kW PSU reference design hits over 99% efficiency and 113 W/in³ power density using Si, SiC, and GaN technologies.

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Digi Launches Medical-Grade Serial Server for Patient Care

Digi’s Connect EZ 4 WS bridges medical serial equipment to modern networks with IEC 60601-1 compliance, encryption, Wi-Fi, and remote management.

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SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

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