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Renesas Chiplet SoC Tech for Automotive SDV ECUs

Renesas develops automotive SoC technologies for SDV-era multi-domain ECUs, combining chiplet safety across UCIe, expanded AI NPUs, and advanced multi-domain power control.

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Renesas 3nm TCAM Architecture Targets Automotive SoCs

Renesas introduces a 3nm FinFET TCAM architecture achieving 5.27 Mb/mm² density, 0.167 fJ per bit search energy, and enhanced functional safety for automotive SoCs, presented at ISSCC 2026.

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ABLIC S-19760/1 Automotive Shunt Reference at ±0.1%

ABLIC S-19760 and S-19761 automotive shunt reference ICs deliver ±0.1% output accuracy and low temperature drift for precise ADC reference voltage in EV inverters and automotive control systems.

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Toshiba ST2000JXH35A 6500V IEGT Reshapes HVDC Stack Design

Toshiba’s ST2000JXH35A 6500V 2000A press pack IEGT targets HVDC transmission, STATCOM systems and industrial drives with improved turn-off margin and short-circuit withstand capability.

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Diotec PW4512 1200V 45A Rectifier For Industrial Power

Diotec PW4512 standard recovery rectifier diode offers 1200V reverse voltage, 45A average forward current, 300A surge capability, and TO-247-2L packaging for industrial power supplies, inverters, and protection stages.

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JAE DW15 Floating Connector Enables Autonomous Robot Charging

JAE DW15 Series floating connector supports autonomous charging of AGVs and AMRs with 60A at 250V DC capability, double-floating misalignment compensation, busbar contact design, and 10,000 mating cycle durability.

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Could China Dominate the RAM Market? CXMT Thinks So

China is responding to global RAM shortages with CXMT modules, leveraging RISC-V, EVs, and all-in-one PCs to meet market demand, proving that functional memory and processors can be produced even a few years behind cutting-edge technology.

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South Korea Pushes For National Semiconductor Power Sovereignty

South Korea has launched a national task force led by Koo Sang-mo to achieve power semiconductor self-reliance by 2030, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies for EVs, power grids, AI data centers, defense, and robotics.

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Researchers Create Carbon Layer 0.8nm thick for future Hard Disk Drives

Despite the rise of SSDs, hard disk drives remain critical for large-scale and cost-effective data storage. This article explores HDD evolution, mechanical limitations, breakthroughs like the 0.8nm MAC protective layer, and why HDDs will continue to dominate archival, cloud, and high-density storage applications.

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China Moving Towards Liquid Cooling For New Datacenters

China’s rapid AI expansion is driving server power and thermal densities beyond the limits of air cooling, forcing a nationwide shift to liquid-cooled data centres. This article examines China’s semiconductor constraints, the rise of companies like Envicool and Sanhua, government initiatives, and why liquid cooling is becoming essential for next-generation high-performance computing.

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