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TDK Expands Micro POL Modules for AI Edge Power Rails

TDK has introduced the FS3303 micro POL power module for AI edge systems and optical networking hardware, delivering 3 A in a 2.5 mm × 2.5 mm package with integrated power components.

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AOS Targets Intel Panther Lake with New IMVP9.3 Power Controllers

Alpha and Omega Semiconductor has introduced new IMVP9.3 multiphase controllers and Smart Power Stages for Intel Panther Lake and Wildcat Lake laptops, targeting lower idle power, faster transient response, and denser mobile CPU power layouts.

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Toshiba SmartMCD Integrates MCU and MOSFETs for BLDC Drives

Toshiba has started sampling the TB9M040FTG SmartMCD device, integrating an Arm Cortex-M23 MCU, MOSFETs, LIN transceiver, and BLDC motor driver into a compact package for automotive motor control systems below 40 W.

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NASA Develops New Chip To Allow Spacecraft To Operate Independently

To try and solve the issue with spacecraft needing constant human attention and the issues of long communication round-trips, NASA have recently developed an AI chip that has 500 times the performance of earlier designs. What challenges do spacecraft face, what did NASA develop, and why could it be the future of spacecraft design?

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China’s Latest Supercomputer Eliminates US GPUs, Packing 2.4 million Huawei Cores

China’s announcement of its latest supercomputer demonstrates that the US ban on GPU sales to China has had minimal effect. What challenges has China faced, what has it developed, and why does this finally show that bans are highly ineffective?

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Kioxia and Dell Pack 9.8 PB of Flash Into a 2U Server

Kioxia and Dell Technologies have demonstrated a 2U storage server carrying 9.8 PB of flash storage using forty 245.76 TB PCIe 5.0 NVMe SSDs for AI infrastructure and enterprise data center workloads.

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Littelfuse Expands Shock Block GFCI Line for 30A Systems

Littelfuse has expanded its Shock Block GFCI lineup with the SB4000, a compact Class A protection device for 208 V to 240 V industrial, HVAC, food processing, and retrofit applications up to 30 A.

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MaxLinear Launches Trinity Platform For 10Gbps 5G Backhaul

MaxLinear has launched the Trinity wireless backhaul platform with the URX850 SoC, supporting 10Gbps 5G backhaul, AI-based network management, and integrated carrier-grade infrastructure functions.

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Microchip Adds EX-423 EMXO For Low-Power Timing Systems

Microchip has launched the EX-423 evacuated miniature crystal oscillator, combining low power consumption, vacuum-sealed thermal isolation, and stable timing performance for GNSS, military, and test systems.

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TDK Adds i9C Buck-Boost DC-DC Modules With 99% Efficiency Mode

TDK-Lambda has launched the i9C non-isolated buck-boost DC-DC converter series with programmable pass-through technology, supporting up to 99% efficiency in robotics and battery-powered systems.

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TDK Expands Micro POL Modules for AI Edge Power Rails

AOS Targets Intel Panther Lake with New IMVP9.3 Power Controllers

Toshiba SmartMCD Integrates MCU and MOSFETs for BLDC Drives

NASA Develops New Chip To Allow Spacecraft To Operate Independently

China’s Latest Supercomputer Eliminates US GPUs, Packing 2.4 million Huawei Cores

Kioxia and Dell Pack 9.8 PB of Flash Into a 2U Server

Littelfuse Expands Shock Block GFCI Line for 30A Systems

MaxLinear Launches Trinity Platform For 10Gbps 5G Backhaul

Microchip Adds EX-423 EMXO For Low-Power Timing Systems

TDK Adds i9C Buck-Boost DC-DC Modules With 99% Efficiency Mode

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