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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

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TI Expands C2000 MCU Line for High-Performance, Low-Cost Motor Control

Texas Instruments’ new F28E12x MCUs deliver 30% more processing power, integrated analog, and advanced FOC features for smoother, quieter, and more efficient motor control in appliances and power tools.

texas instruments, c2000 mcu, motor control, field oriented control, foc, motor drives, power tools, washing machines, embedded design, dsp, appliance design, high speed motors, analog integration, microcontrollers, motor control algorithms

Infineon Adds High-SNR, Low-Power MEMS Microphones to XENSIV Lineup

Infineon’s IM72D128V and IM69D129F combine IP57 durability, low power draw, and precise digital audio for next-generation portable devices.

infineon, xensiv, mems microphone, im72d128v, im69d129f, audio capture, anc, ip57, low power, voice ui, consumer electronics, automotive electronics

NOVOSENSE NSUC1612 Motor Driver SoC Simplifies Automotive Actuator Design

NOVOSENSE’s NSUC1612 integrates MCU, drivers, and comms in one chip, cutting cost and complexity for next-generation automotive actuators.

novosense, nsuc1612, motor driver soc, automotive actuators, aec-q100, lin, can, bldc, stepper motor, cispr 25, automotive electronics

ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

rohm, dot-247, silicon carbide, sic module, power electronics, pv inverters, ups systems, multi-level inverters, half-bridge, common-source, aec-q101, industrial power

Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

wolfspeed, silicon carbide, 200mm, sic wafers, power devices, mosfet yield, automotive, ev, renewables, power electronics

Infineon Unveils 12 kW High-Density PSU Reference Design for AI Data Centers

Infineon’s 12 kW PSU reference design hits over 99% efficiency and 113 W/in³ power density using Si, SiC, and GaN technologies.

infineon, psu, ai data centers, high-efficiency power conversion, wide-bandgap, sic, gan, power factor correction, llc resonant converter, energy buffer, power density

Digi Launches Medical-Grade Serial Server for Patient Care

Digi’s Connect EZ 4 WS bridges medical serial equipment to modern networks with IEC 60601-1 compliance, encryption, Wi-Fi, and remote management.

digi international, connect ez 4 ws, serial server, iec 60601-1, medical device networking, healthcare it, emr integration, realport, python automation, cybersecurity

SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing

Deca and SST Partner to Advance NVM Chiplet Architectures

Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.

deca, silicon storage technology, microchip, chiplets, nvm, superflash, adaptive patterning, semiconductor packaging, heterogeneous integration, multi-die systems, advanced packaging

TI TMAG5134 Hall-Effect Switch Reaches 1 mT Sensitivity

Texas Instruments’ TMAG5134 Hall-effect switch detects magnetic fields down to 1 mT, enabling smaller magnets, lower system cost, and longer battery life.

texas instruments, ti, tmag5134, hall effect switch, in-plane sensor, magnetic sensing, 1 mt sensitivity, low power, timss, reed switch replacement, tmr, amr, gmr, door sensors, appliances, consumer electronics

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