Renesas Adds AI Muscle to Edge HMI Systems with New 64-bit RZ/G3E MPU

Renesas has launched the RZ/G3E, a new quad-core 64-bit MPU designed to power next-generation human-machine interface (HMI) systems that demand real-time edge AI and rich multimedia performance. Aimed at applications like factory automation, medical displays, smart retail, and building control systems, the device brings Full HD video, local AI processing, and high-speed I/O into a single, scalable platform.

At its core, the RZ/G3E features four Arm® Cortex®-A55 CPUs running up to 1.8GHz, supported by a Cortex-M33 and an integrated Ethos™-U55 NPU, delivering up to 512 GOPS of AI performance. This combination enables efficient image classification, anomaly detection, voice recognition, and object tracking without placing a significant load on the CPU. Whether it’s a touchscreen interface or an embedded vision node, the RZ/G3E is built to keep edge devices responsive and intelligent.

Designed for Next-Gen HMIs

Graphics performance is front and centre, with dual Full HD outputs (1920x1080 at 60fps) and flexible display support via MIPI-DSI, dual-link LVDS, and parallel RGB. A MIPI-CSI input enables camera-based applications and video analytics, making the MPU well-suited to vision-guided interfaces.

Connectivity is another highlight. The chip supports:

• PCIe 3.0 (2 lanes) for fast storage and 5G modules
• USB 3.2 Gen2 and dual Gigabit Ethernet for high-throughput data movement
• CAN-FD for robust industrial communication

Smarter Power Management

Renesas has integrated advanced low-power modes, including sub-CPU standby and deep sleep at ~1mW. The result is fast Linux resume times with data integrity preserved in DDR self-refresh, making it ideal for always-on edge nodes.

Linux Support and Longevity

Software support includes Renesas' Verified Linux Package (VLP)—with 10+ years of maintenance, and Linux BSP Plus for access to the latest LTS kernels and Yocto. Ubuntu and Debian builds are also available for users building more traditional Linux applications. The RZ/G3E will be offered in two BGA package sizes (15mm and 21mm), rated for operation from -40°C to 125°C, and supported under Renesas’ 15-year longevity program.

Ready-to-Go Modules and Design Platforms

To accelerate adoption, Renesas and partners are launching a range of System-on-Module (SoM) solutions, including:

• SMARC module from Tria
• OSM Size-M from ARIES Embedded
• OSM Size-L from MXT

Engineers can also tap into Renesas’ “Winning Combinations,” including a dual-display Full HD HMI reference platform and a digital otoscope solution. These pre-vetted architectures combine Renesas products to simplify development and reduce risk.

Availability and Pricing

The RZ/G3E is available now, along with a full evaluation kit featuring a SMARC v2.1.1 module and carrier board.

Learn more, access the datasheet and view the original announcement here.

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