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Navitas Expands GaN and SiC Power Devices for 800 V AI Data Centres

Navitas extends its GaNFast and GeneSiC semiconductor portfolio to support NVIDIA’s 800 V AI data-centre architecture with higher efficiency and density.

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Littelfuse Launches First Reflow-Compatible Illuminated Tactile Switch

Littelfuse expands its K5V tactile switch family with the reflow-capable K5V4 series, offering SPDT contacts, LED backlighting, and long-travel tactile response. Primary Product Category: Switches and Interface Components

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Infineon Expands OptiMOS 7 MOSFET Line for Switching and Motor Drives

Infineon has released new OptiMOS 7 MOSFETs for industrial and consumer designs, with 25 V and 40 V variants optimised for switching and motor drives.

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Microchip MCP9604 Enables ±1.5°C Four-Channel Thermocouple Measurement

Microchip’s MCP9604 integrates four-channel thermocouple conditioning with I²C output, achieving ±1.5 °C accuracy and reducing BOM complexity.

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Toshiba 100V TPH2R70AR5 MOSFET Improves Efficiency and Switching Speed

Toshiba’s 100V TPH2R70AR5 N-channel MOSFET offers 2.7 mΩ RDS(on), 37% lower Qg, and faster recovery for efficient SMPS and DC-DC converters in data centres and industrial systems.

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TDK Introduces SmartMotion ICM-45685 IMU for Next-Generation Smart Glasses

TDK’s new ICM-45685 SmartMotion IMU delivers precise head tracking, OIS/EIS, and activity recognition for AR and AI glasses at ultra-low power.

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Microchip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design

Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.

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Renesas Adds Capacitive Touch to Its Smallest, Lowest-Power RA0 MCUs

Renesas expands its RA0 MCU line with the RA0L1 series, adding built-in capacitive touch, ultra-low-power operation, and fast wake-up for cost-sensitive consumer, industrial, and battery-powered applications.

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Infineon Adds High-SNR, Low-Power MEMS Microphones to XENSIV Lineup

Infineon’s IM72D128V and IM69D129F combine IP57 durability, low power draw, and precise digital audio for next-generation portable devices.

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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

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