Latest News
The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.
Navitas Expands GaN and SiC Power Devices for 800 V AI Data Centres
Navitas extends its GaNFast and GeneSiC semiconductor portfolio to support NVIDIA’s 800 V AI data-centre architecture with higher efficiency and density.
Read MoreLittelfuse Launches First Reflow-Compatible Illuminated Tactile Switch
Littelfuse expands its K5V tactile switch family with the reflow-capable K5V4 series, offering SPDT contacts, LED backlighting, and long-travel tactile response. Primary Product Category: Switches and Interface Components
Read MoreInfineon Expands OptiMOS 7 MOSFET Line for Switching and Motor Drives
Infineon has released new OptiMOS 7 MOSFETs for industrial and consumer designs, with 25 V and 40 V variants optimised for switching and motor drives.
Read MoreMicrochip MCP9604 Enables ±1.5°C Four-Channel Thermocouple Measurement
Microchip’s MCP9604 integrates four-channel thermocouple conditioning with I²C output, achieving ±1.5 °C accuracy and reducing BOM complexity.
Read MoreToshiba 100V TPH2R70AR5 MOSFET Improves Efficiency and Switching Speed
Toshiba’s 100V TPH2R70AR5 N-channel MOSFET offers 2.7 mΩ RDS(on), 37% lower Qg, and faster recovery for efficient SMPS and DC-DC converters in data centres and industrial systems.
Read MoreTDK Introduces SmartMotion ICM-45685 IMU for Next-Generation Smart Glasses
TDK’s new ICM-45685 SmartMotion IMU delivers precise head tracking, OIS/EIS, and activity recognition for AR and AI glasses at ultra-low power.
Read MoreMicrochip DualPack 3 IGBT7 Modules Boost Power Density and Simplify Design
Microchip’s DualPack 3 IGBT7 modules cut losses up to 20%, support 175 °C overload, and reduce system complexity for motor drives, renewables, and traction.
Read MoreRenesas Adds Capacitive Touch to Its Smallest, Lowest-Power RA0 MCUs
Renesas expands its RA0 MCU line with the RA0L1 series, adding built-in capacitive touch, ultra-low-power operation, and fast wake-up for cost-sensitive consumer, industrial, and battery-powered applications.
Read MoreInfineon Adds High-SNR, Low-Power MEMS Microphones to XENSIV Lineup
Infineon’s IM72D128V and IM69D129F combine IP57 durability, low power draw, and precise digital audio for next-generation portable devices.
Read MoreROHM Launches DOT-247 SiC Module with 2.3× Power Density
ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.
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