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Could China Dominate the RAM Market? CXMT Thinks So

China is responding to global RAM shortages with CXMT modules, leveraging RISC-V, EVs, and all-in-one PCs to meet market demand, proving that functional memory and processors can be produced even a few years behind cutting-edge technology.

China, RAM shortage, CXMT, DDR5, LPDDR5X, RISC-V, open-source processors, electric vehicles, mini PCs, consumer electronics, memory supply, semiconductor industry, PC components, global tech, AI data centers

RISC-V Process Made on Intel 3 Process – New Step in Open Source Computing

RISC-V moves closer to mainstream computing with a successful Intel 3 fabrication milestone and Linux bring-up. We examine the TC1 processor, European silicon efforts, ecosystem challenges, and what RISC-V must solve to compete with Intel, AMD, and ARM in general-purpose desktop and server platforms.

RISC-V, Intel 3, TC1 RISC-V chip, European Processor Initiative, Barcelona Supercomputing Center, open-source hardware, RISC-V processor ecosystem, Linux RISC-V support, PCIe Gen5, DDR5, heterogeneous RISC-V cores, Sargantana core, Lagarto Ka, Lagarto Ox, high performance computing, HPC processors, desktop RISC-V, server RISC-V, processor standardization, open ISA

Tesla AI5 Chip – The World of Custom Chips

Tesla's AI5 chip, designed for self-driving vehicles and robotics, marks a major shift in custom AI chip development. With Samsung's help, Tesla aims to revolutionize autonomous tech, integrating custom neural cores and ARM CPUs for optimized performance.

tesla, ai5 chip, custom ics, self-driving vehicles, tesla ai, elon musk, ai chips, samsung, arm cpus, autonomous technology, robotics, full self-driving, chip development, ai hardware, automotive innovation

Researchers Create Ultrasonic Wireless Charging For Implantable Sensors

Recently, researchers have created an ultrasonic wireless charging platform for use with implanted medical devices. What challenges do implanted medical devices face, what exactly did the researchers develop, and how could it help change the future of medical devices?

implanted medical devices, wireless charging, ultrasound energy harvesting, dgist research, medical sensors, biocompatibility, power solutions, battery technology, medical electronics, implantable technology, ultrasound charging efficiency, microcontroller power, remote patient monitoring, medical device innovation, energy harvesting technology

TDK DC-Link Capacitors Target High-Frequency SiC Power Systems

TDK has introduced the B25696H series of DC-link film capacitors for SiC-based power electronics. The capacitors offer voltage ratings from 900VDC to 2000VDC, capacitance up to 1280µF, self-inductance as low as 30nH, and ripple current capability up to 91A.

TDK, B25696H, DC Link Capacitor, Film Capacitor, MKP Capacitor, SiC, Silicon Carbide, Power Electronics, Energy Storage System, ESS, Solid State Transformer, SST, Renewable Energy, Motor Drive, Traction Inverter, Power Converter, Passive Components

Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Diodes Incorporated has introduced the PI6CG33A06 PCIe 7.0 clock generator with sub-30fs RMS jitter, six differential outputs, and LP-HCSL outputs for servers, HPC systems, and AI infrastructure.

Diodes Incorporated, PI6CG33A06, PCIe 7.0, PCIe Clock Generator, Clock Generator, Low Jitter Clock, AI Infrastructure, Data Center, HPC, Servers, Networking Equipment, PCI Express, LP-HCSL, HCSL, Reference Clock, Timing IC, SMBus, CK440Q, 100MHz Clock, 25MHz Clock, Semiconductor

Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

Infineon’s TDM24745T quad-phase TLVR power module delivers over 2 A/mm² current density and up to 320 A peak current for AI accelerators, GPUs, and dense server power architectures where transient response and board space are under pressure.

Infineon, TDM24745T, OptiMOS, TLVR, trans-inductor voltage regulator, quad-phase power module, AI data center, AI accelerator, GPU power delivery, server power, core rail, multiphase controller, OptiMOS 6, power density, current density, transient response, decoupling capacitors, vertical power delivery, lateral power delivery, data center power

SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

SemiQ’s 1200 V QSiC Dual3 half-bridge modules combine low RDSon SiC MOSFETs, optional Schottky diodes, and high power density to help replace IGBT modules in data center cooling, energy storage, and industrial power converters.

SemiQ, QSiC Dual3, silicon carbide, SiC MOSFET, half-bridge module, 1200 V, Schottky barrier diode, power converter, data center cooling, liquid chiller, energy storage, grid converter, industrial drive, IGBT replacement, power density, RDSon, active front end, compressor drive, power module

China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Recently, China announced that it has developed the world's thinnest power wafers at 35 microns. But why exactly does this matter, how has China achieved this, and what does it mean for the rest of the world?

Power electronics, Energy distribution, Semiconductor wafers, Wafer thickness, Bulk electrical resistance, Thermal properties, 35 micron wafers, China semiconductor industry, Advanced chipmaking technologies, EV fast chargers.

Microchip LX4580 Mixed-Signal IC for Actuation Systems

Microchip’s LX4580 is a 24 channel mixed signal IC designed for aviation and defense actuation systems, integrating sensor interfaces, motor control outputs, and high speed ADCs in a single device.

Microchip, LX4580, mixed signal IC, aviation electronics, flight control electronics, actuator control systems, aerospace semiconductors, LVDT interface, resolver interface, SAR ADC, motor control IC, defense electronics, More Electric Aircraft, actuator sensors, aerospace embedded systems

Could China Dominate the RAM Market? CXMT Thinks So

RISC-V Process Made on Intel 3 Process – New Step in Open Source Computing

Tesla AI5 Chip – The World of Custom Chips

Researchers Create Ultrasonic Wireless Charging For Implantable Sensors

TDK DC-Link Capacitors Target High-Frequency SiC Power Systems

Diodes Introduces PCIe 7.0 Clock Generator For 128GT/s Links

Infineon TLVR Power Module Pushes Current Density Past 2 A/mm²

SemiQ Dual3 SiC Modules Push IGBT Drop-In Further

China Unveils Worlds-First 35 Micron Ultra-Thin Power Wafer Production Line

Microchip LX4580 Mixed-Signal IC for Actuation Systems

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