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SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

SK hynix, iHBM, HBM, HBM5, AI memory, high bandwidth memory, thermal management, AI accelerator, GPU memory, HPC, data center, semiconductor packaging, MR-MUF, wafer level packaging, memory cooling, D2D PHY, AI infrastructure, advanced packaging, memory technology

Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

alphawave semi, ucie, 3dfabric, tsmc soic-x, 3d stacking, chiplet, die-to-die, ai, hpc, semiconductor packaging, semiconductors

Deca and SST Partner to Advance NVM Chiplet Architectures

Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.

deca, silicon storage technology, microchip, chiplets, nvm, superflash, adaptive patterning, semiconductor packaging, heterogeneous integration, multi-die systems, advanced packaging

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Deca and SST Partner to Advance NVM Chiplet Architectures

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