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Renesas Expands Magnet-Free Inductive Position Sensor Line for Automation and Robotics

Renesas’ new inductive position sensors provide accurate, magnet-free motion feedback for robotics and automation, supported by an online coil design tool.

renesas electronics, raa2p3226, raa2p3200, raa2p4200, inductive position sensor, ips, industrial automation, robotics, motor control, encoder, coil design, sensing technology, semiconductors

Diodes PI7C9X762Q Improves Communication Inside Electric Vehicles

The Diodes PI7C9X762Q bridge connects I2C, SPI, and UART buses in EV and automotive systems with low power and compact design.

diodes incorporated, pi7c9x762q, uart bridge, i2c, spi, automotive electronics, ev systems, adas, interface ic, serial communication, zonal architecture, power efficiency, connectivity

TE Connectivity Unveils Inside Device Connectivity Solutions for Automotive Modules

TE Connectivity’s in-device connectivity portfolio brings board-to-board, wire-to-board, flex and wire connectors optimized for automotive ECUs and SDR architectures.

te connectivity, in-device connectivity, ecu connectors, connectors, software defined vehicle, board-to-board, wire-to-board, flex-to-board, adas, automotive electronics

ST and Tobii Bring Single-Camera Interior Sensing to Mass Production

STMicroelectronics and Tobii have entered mass production of an interior sensing system that combines RGB and IR imaging for driver and occupant monitoring.

stmicroelectronics, tobii, vd1940, safesense, driver monitoring, occupancy monitoring, interior sensing, automotive safety, in-cabin sensing, imaging sensors

Infineon OptiMOS TDM22545T Brings TLVR Power Modules to AI Data Centres

Infineon introduces the OptiMOS TDM22545T, a TLVR-based dual-phase module designed to boost efficiency and transient response in AI servers.

infineon, optimos, tdm22545t, tlvr, power modules, ai data centres, vertical power delivery, transient response, pdn efficiency, green computing

XP Power BCT40T Brings 40W DC-DC Conversion to a 1” x 1” Format

XP Power’s BCT40T series offers 40W of output in a 1” x 1” package, combining efficiency, flexibility, and built-in protection for compact designs.

xp power, bct40t, dc-dc converter, compact power supply, industrial electronics, robotics, automation, pcb design, power density, communications

Silicon Labs Series 3 SoCs Bring PSA Level 4 Security and Matter-Certified Platform Support

Silicon Labs’ SixG301 family debuts with PSA Level 4 security and Matter Compliant Platform certification, enabling faster IoT product development.

silicon labs, sixg301, simg301, sibg301, series 3, soc, psa level 4, matter, secure vault, iot security, smart lighting, embedded systems

Alphawave Semi Brings UCIe 3D Chiplet IP to TSMC’s 3DFabric Platform

Alphawave Semi tapes out UCIe 3D IP on TSMC’s SoIC-X 3DFabric, offering 10× power efficiency and 5× signal density for AI and HPC chiplet designs.

alphawave semi, ucie, 3dfabric, tsmc soic-x, 3d stacking, chiplet, die-to-die, ai, hpc, semiconductor packaging, semiconductors

ROHM Smart Switches Enhance Zonal Controllers with High-Capacitance Drive

ROHM’s BV1HBxxxEFJ-C smart switches combine low ON resistance, high-capacitance load drive, and precise current sensing for automotive zonal controllers. Primary Product Category: Automotive Power Devices

rohm, smart switch, ipd, zonal controller, automotive electronics, current sensing, body control, ev, functional safety, high-capacitance load

TI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging

Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.

texas instruments, ti, dlp991uuv, dlp technology, digital lithography, maskless lithography, advanced packaging, semiconductor manufacturing, data centres, 5g

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