News | The Component Club

EPC GaN Power Stages Push Motor Drives Toward Simpler Control

EPC’s new 100 V integrated GaN power stages combine FETs, gate drive, and protection in a compact package, giving motor drive, robotics, and power conversion designers tighter shutdown control, 100% duty-cycle support, and simpler system integration.

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congatec Extends Core Ultra COMs for Rugged Edge AI

congatec has expanded its Intel Core Ultra Series 3 COM family with rugged -40 °C to +85 °C variants for embedded edge AI and industrial systems.

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EPC GaN Inverter Board Targets Faster BLDC Prototyping

EPC’s EPC91121 gives engineers a compact three-phase GaN inverter platform for 24 V-class BLDC development, combining 50 ARMS output, integrated sensing, controller support, and switching up to 150 kHz.

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TE Connectivity MezzaWave Connectors Aim at Denser 56G Links

TE Connectivity has launched 56G MezzaWave connectors and cable assemblies for dense modular systems, supporting up to 56 Gbps PAM4 with open-pin-field architecture, routing flexibility, and standards-based interoperability.

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South Korea Pushes For National Semiconductor Power Sovereignty

South Korea has launched a national task force led by Koo Sang-mo to achieve power semiconductor self-reliance by 2030, focusing on silicon carbide (SiC) and gallium nitride (GaN) technologies for EVs, power grids, AI data centers, defense, and robotics.

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Kontron mITX Board With Ryzen AI Embedded P100 Targets Real-Time Edge AI

Kontron’s K4131 Px mITX motherboard uses the AMD Ryzen AI Embedded P100 to combine multi display graphics, local AI inference, legacy connectivity and wide input power handling for industrial edge automation, vision and HMI systems.