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Filtering by tag: "power electronics"

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ROHM Launches DOT-247 SiC Module with 2.3× Power Density

ROHM’s new DOT-247 SiC module delivers 2.3× power density, 15% lower thermal resistance, and supports advanced multi-level power topologies.

rohm, dot-247, silicon carbide, sic module, power electronics, pv inverters, ups systems, multi-level inverters, half-bridge, common-source, aec-q101, industrial power

Wolfspeed Launches 200 mm SiC Wafers for High-Volume Power Device Production

Wolfspeed’s 200 mm SiC wafers and epitaxy are now commercially available, improving yields and scalability for power electronics makers worldwide.

wolfspeed, silicon carbide, 200mm, sic wafers, power devices, mosfet yield, automotive, ev, renewables, power electronics

Researchers Create New Gallium Oxide Semiconductor With Superior Current Capabilities

Researchers at Nagoya University have developed stable p-type gallium oxide (Ga₂O₃) diodes capable of handling twice the current of previous devices, addressing a key limitation that held the material back. Could this breakthrough make Ga₂O₃ a practical alternative to GaN, and what applications will benefit most from its improved efficiency?

gallium oxide, ga2o3, gallium nitride, gan, power electronics, pn diode, p-type semiconductor, high-efficiency semiconductors, nagoya university, energy-efficient devices, rectifiers, next-generation semiconductors, semiconductor breakthrough, electric vehicles, renewable energy, power supply design

Murata Expands Isolated DC-DC Converters for PoE Devices

Murata introduces compact isolated DC-DC converters for IEEE 802.3af PoE systems, delivering efficient 5 V power in space-constrained devices such as cameras and biometric units.

murata, dc-dc converter, power over ethernet, poe, ieee802.3af, ip cameras, biometric devices, wireless access points, power electronics

EPC Highlights GaN Power Advances at PCIM Asia 2025

EPC will showcase GaN solutions for AI servers, robotics, and UAVs at PCIM Asia 2025, as momentum grows for GaN to replace silicon in high-frequency power.

epc, gan, power electronics, ai servers, data centres, robotics, uavs, drones, dc-dc conversion, pcim asia 2025

EPC Launches Radiation-Hardened GaN Motor Drive Evaluation Board for Space Applications

The EPC7C021 from EPC Space is a compact, radiation-hardened GaN motor drive board for use in space and aerospace environments.

epc, gan, radiation hardened, motor drive, three phase, aerospace, robotics, evaluation board, motion control, power electronics, space systems, egan, reaction wheels, ion thrusters

Toshiba 650V SiC MOSFETs Boost Efficiency With Compact TOLL Package

Toshiba has launched 3rd generation 650V SiC MOSFETs in a compact TOLL package, cutting switching losses and improving power density for industrial and energy systems.

toshiba, sic, mosfet, wide bandgap, power electronics, toll package, data centre, ups, ev charging, pv inverter

Infineon Expands OptiMOS 6 Portfolio with 150 V Automotive MOSFETs

Infineon’s OptiMOS 6 150 V MOSFETs deliver 2.5 mΩ RDS(on), low switching losses, and thermal resistance of 0.4 K/W, with TOLL, TOLG, and TOLT packaging for xEV designs.

infineon, optimos 6, mosfet, automotive, ev, two-wheeler, dc/dc converter, inverter, power electronics, thermal management, aec-q101, ppap

SCHURTER FPR Fuseholder Increases Power Density in Compact Designs

SCHURTER’s FPR fuseholder delivers 30% higher power handling in the same footprint, offering higher thermal capacity without PCB redesign.

schurter, fuseholder, power electronics, circuit protection, high current, pcb design, industrial automation, building automation, mechanical engineering

SCHURTER ALO Fuse Series Supports 800 V EV Platforms

SCHURTER’s ALO fuses deliver up to 1000 VDC and 900 A protection, meeting global EV standards and supporting next-gen 800 V architectures.

schurter, ev fuse, electric vehicles, automotive electronics, high voltage, battery management, circuit protection, pdu, bms, power electronics

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