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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


Bourns SRP4020T Power Inductors Tackle Heat and Current in Tight Spaces

The Bourns SRP4020T inductor series uses carbonyl powder cores and magnetic shielding to deliver high current handling in compact power designs.

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onsemi EliteSiC Powers Schaeffler Inverter for Next-Gen PHEVs

Schaeffler selects onsemi’s EliteSiC MOSFETs for a new plug-in hybrid inverter platform, improving power density, thermal performance, and efficiency.

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STMicroelectronics to Acquire NXP’s MEMS Sensor Business for $950M

STMicroelectronics will acquire NXP’s MEMS sensor division for $950 million, expanding its sensor portfolio across automotive, industrial, and consumer markets.

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Kioxia Ships 512Gb TLC 9th Gen BiCS FLASH for AI and IoT

Kioxia begins sampling its 9th-gen 512Gb TLC BiCS FLASH™ memory, boosting performance and power efficiency for SSDs, AI, and industrial IoT.

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KYOCERA AVX Launches Compact SPE Connectors for Industrial Ethernet Networks

KYOCERA AVX launches compact Single-Pair Ethernet (SPE) connectors to simplify industrial networks and save board space.

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TDK Expands Ferrite Core Range for High-Power Industrial Applications

TDK launches an industry-leading lineup of large-size ferrite cores for EVs, renewables, traction systems, and more.

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Toshiba’s New MOSFETs Use Advanced Packaging to Cut Losses and Boost Efficiency

Toshiba launches new MOSFETs in SOP Advance(E) package, reducing RDS(on) and thermal resistance for efficient SMPS performance.

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Vishay’s M61 Trimmer Offers Industrial Precision in a Compact Form

Vishay’s M61 cermet trimmer offers tuning accuracy, flexible mounting options, and sealed construction for rugged industrial use.

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Micron Launches Radiation-Tolerant NAND for Space-Grade Data Storage

Micron debuts its first space-qualified 256Gb SLC NAND, built for high-radiation environments and next-gen aerospace edge computing.

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Rohde & Schwarz and Qualcomm Test NG eCall Ahead of 2026 EU Rollout

With EU regulations shifting, Rohde & Schwarz and Qualcomm validate NG eCall over 5G using the Snapdragon Auto platform and CMX500 tester.

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