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The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.


binder Expands Compact M9 Connector Portfolio for Demanding Applications

binder expands its M9 circular connector series for compact, rugged applications in automation, medical, and measurement systems. IP67 rated and built for durability.

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Microchip Launches Off-the-Shelf Radiation-Hardened 15 W Power Converter for Space Applications

Microchip launches SA15‑28, a 15 W radiation-hardened DC-DC converter with EMI filter for high-reliability space and satellite power systems.

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TDK Launches Industry’s Highest-Capacitance 100 V MLCC in 1608 Size

TDK launches a 1 µF, 100 V MLCC in 1608 size, the industry’s highest capacitance for this spec, supporting BOM reduction in 48 V and industrial systems.

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ROHM SiC MOSFETs Power Toyota’s New bZ5 BEV in Chinese Market

ROHM’s SiC MOSFETs power Toyota’s new bZ5 BEV in China, boosting inverter efficiency and range through HAIMOSIC’s high-volume production.

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Microchip Expands TrustMANAGER Platform to Meet New Cybersecurity Regulations

Microchip enhances TrustMANAGER with secure FOTA and remote key management to meet EU Cyber Resilience Act and RED compliance for connected devices.

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EPC Space Launches Industry-Leading 300 V Rad‑Hard GaN FET for Satellite Power Systems

EPC Space launches a 300 V radiation‑hardened GaN FET with top-tier current handling and efficiency for high-voltage satellite power systems.

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Samtec Introduces Bulls Eye® ISI Evaluation Boards for Simplified SerDes Testing

Samtec’s new Bulls Eye ISI Evaluation Boards support 70 GHz and 90 GHz SerDes testing, streamlining multi-lane validation across PAM4 and PAM6 designs.

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Vishay AEC-Q200 Chip Resistors Perform to 70 GHz

Vishay’s CHA series thin film chip resistors deliver stable 70 GHz performance for automotive, aerospace, and RF applications.

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EPC 180 W GaN Buck Converter Evaluation Board for USB Power Delivery Applications

EPC has launched the EPC91109, a 180 W GaN-based buck converter evaluation board for USB-PD 3.1 applications. Featuring EPC2057 GaN FETs and the LTC7890 controller, it delivers up to 14.3 A with over 98% efficiency—all in a compact 24 mm x 24 mm footprint without a heatsink or airflow. Ideal for laptops and portable systems, the board demonstrates GaN’s potential to replace silicon in high-power, space-constrained designs.

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TE Connectivity Launches Modular MULTIGIG TRX Platform for Rugged Fibre Optic Applications

TE Connectivity has launched its MULTIGIG TRX platform, a modular fibre optic transceiver system for aerospace, defence, and marine markets. Featuring up to 12 hot-swappable 10 Gbps transceivers, it enables faster data, simplified upgrades, and minimal downtime. Qualified to standards like DO-160G and MIL-STD-883, the platform offers high-speed connectivity in rugged environments and supports future expansion without reworking the PCB or replacing the full module.

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