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Filtering by tag: "semiconductor manufacturing"

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Applied Materials Advances GAA Transistor Engineering For Faster AI Chips At 2nm And Beyond

Applied Materials introduces new deposition, etch and radical treatment systems that improve GAA transistor nanosheets, reduce contact resistance and enhance trench precision for 2nm and angstrom class AI chips, boosting energy efficient compute performance.

Applied Materials, GAA transistors, nanosheets, 2nm process, angstrom era, transistor engineering, radical treatment, Viva system, Sym3 Z Magnum, Spectral ALD, molybdenum contacts, tungsten replacement, plasma etch control, AI chips, semiconductor manufacturing, device scaling, advanced logic nodes, materials engineering

Could X-Ray Lithography Be The Key To Future Semiconductors

As extreme ultraviolet lithography approaches its physical limits, the semiconductor industry looks beyond EUV toward X-ray lithography and alternative scaling strategies, exposing the growing challenges of sub-nanometer manufacturing.

EUV lithography, extreme ultraviolet, semiconductor manufacturing, chip fabrication, sub-nanometer nodes, X-ray lithography, ASML, Moore’s Law, transistor scaling, advanced packaging, chiplets, die stacking, optical interconnects, future of semiconductors

Intel Breaking the 2nm Barrier with Panther Lake on 18A Process

As the semiconductor industry pushes beyond 2nm toward angstrom-class technologies, manufacturing faces extreme physical, economic, and scientific limits. This article explores sub-2nm scaling challenges, quantum effects, EUV and high-NA lithography costs, Intel’s 18A Panther Lake ambitions, foundry expansion in the US, and why future progress may rely on chiplets, 3D packaging, and new integration strategies rather than simple transistor shrinking.

semiconductors, sub-2nm, 2nm process, 1nm technology, angstrom-class nodes, Intel 18A, Panther Lake, EUV lithography, high-NA EUV, ASML, semiconductor manufacturing, chip fabrication, advanced process nodes, quantum effects, transistor scaling, Moore’s Law, foundry services, Intel Foundry, CHIPS Act, semiconductor supply chain, chiplets, 3D packaging, wafer-scale integration, Foveros, materials science, nanotechnology, electronics industry

GlobalFoundries and Navitas Advance U.S. GaN Manufacturing for AI Datacenters and High-Power Systems

GlobalFoundries and Navitas form a long-term partnership to expand U.S. GaN technology and manufacturing for AI datacenters, energy and high-power systems.

globalfoundries, navitas semiconductor, gan, gan-on-si, ai datacenters, power electronics, high voltage, energy infrastructure, semiconductor manufacturing, power conversion, data center hardware

TI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging

Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.

texas instruments, ti, dlp991uuv, dlp technology, digital lithography, maskless lithography, advanced packaging, semiconductor manufacturing, data centres, 5g

SK hynix Completes HBM4 Development and Prepares for Mass Production

SK hynix has completed HBM4 development, doubling bandwidth and improving power efficiency by 40% to support growing AI workloads.

sk hynix, hbm4, high bandwidth memory, ai infrastructure, data center, mr-muf, dram, memory packaging, 2, 048 i/o, semiconductor manufacturing

Applied Materials, Apple, and TI Rewire the US Chip Supply Chain

Applied Materials supports Apple and TI with US-made chip equipment and a $200M Arizona investment to boost semiconductor manufacturing and supply chain resilience.

applied materials, semiconductor manufacturing, texas instruments, apple, chip equipment, us chip supply chain, chandler arizona, austin texas, advanced manufacturing, analog semiconductors, embedded semiconductors, fab equipment, us semiconductor investment, domestic chip production