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Toshiba CCD Sensor Boosts Line-Scan Speed For High-Precision Optical Inspection

Toshiba’s TCD2400DG CCD linear image sensor doubles readout speed, integrates its timing generator and delivers full resolution RGB capture for high speed optical inspection, grain sorting and industrial line scan applications.

Toshiba, TCD2400DG, CCD sensor, linear image sensor, line scan, optical inspection, machine vision, RGB channels, 4096 pixel array, 7 µm pitch, 22.7 kHz line rate, 100 MHz data rate, EMI reduction, timing generator, grain sorting, industrial inspection, quality control, imaging systems, embedded vision, semiconductor sensors

Kontron mITX Board With Ryzen AI Embedded P100 Targets Real-Time Edge AI

Kontron’s K4131 Px mITX motherboard uses the AMD Ryzen AI Embedded P100 to combine multi display graphics, local AI inference, legacy connectivity and wide input power handling for industrial edge automation, vision and HMI systems.

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Vishay Expands 0806 and 1210 Inductor Families With Smaller Footprints And Higher Thermal Headroom

Vishay’s new IHLL and IHLP inductors deliver smaller 0806 and 1210 footprints, lower DCR, higher temperature ratings and soft saturation behavior for DC DC converters, automotive electronics, noise suppression and precision industrial systems.

Vishay, IHLL 0806AZ, IHLP 0806AB, IHLL 1210AB, IHLP 1210ABEZ, power inductors, 0806 inductor, 1210 inductor, DC DC converter, low DCR, soft saturation, powdered iron, magnetic shielding, AEC Q200, automotive electronics, noise suppression, filtering, switching regulators, compact power stages, thermal performance, high current inductors, embedded systems

Advantech i.MX 95 Modules Push Real-Time Edge AI Toward More Deterministic Control

Advantech’s i.MX 95 based modules combine multi domain compute, 2 TOPS AI acceleration, multi sensor imaging and TSN networking to support real time industrial automation, machine vision and advanced HMI systems at the edge.

Advantech, NXP, i.MX 95, AOM 5521, AOM 2521, edge AI, machine vision, TSN networking, Cortex A55, Cortex M7, Cortex M33, NPU, ISP, VPU, Mali G310, industrial automation, embedded compute, real time control, deterministic networking, HMI systems, PCIe expansion, CAN FD, industrial edge, semiconductor, embedded modules

Cree LED OptiLamp Pixels Bring Integrated Control To Modern Displays

Cree LED’s OptiLamp devices integrate driver and control logic inside each pixel, enabling smoother visuals, lower power use, true 1 to 1 scan behavior and simpler display architectures for large and small format systems.

Cree LED, OptiLamp, pixel intelligence, LED display, 24 bit control, pixel level management, power efficiency, display systems, video walls, professional displays, embedded driver, optical performance, thermal behavior, color accuracy, system integration, panel reliability, display architecture, multiplexing, semiconductor components

Microchip Power Module Lifts AI Server Density With Vertical Architecture

Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.

Microchip, MCPF1525, power module, DC DC converter, vertical power module, 25A converter, stackable power, PMBus control, I2C control, AI servers, HPC power, PCIe switch power, low noise inductor, high density power design, data center electronics, embedded EEPROM, thermal management

RECOM High-Density DIN Rail Supply Widens Power Margin in Compact Panels

RECOM’s RACPRO1-S240 DIN rail supply provides 240W continuous output, a 150 percent peak power window, wide input flexibility and up to 95 percent efficiency to support industrial, automation and infrastructure systems where cabinet space and thermal margin are limited.

RECOM, RACPRO1-S240, RACPRO1 series, DIN rail power supply, 240W PSU, peak power boost, power margin, ORing diode, redundancy, 24VDC supply, high efficiency converter, industrial automation, building automation, infrastructure power, AC DC module, EMC compliance, wide input range

Toshiba Sine-Wave Controllers Sharpen Bldc Efficiency In Compact Drives

Toshiba’s TC78B043FNG and TC78B043FTG sine wave controllers enable quieter, higher efficiency three phase BLDC motor operation with precise lead angle tuning, integrated protection, and compact packaging for consumer and industrial designs.

Toshiba, TC78B043FNG, TC78B043FTG, BLDC motor control, sine wave drive, motor controllers, IPM motors, SPM motors, lead angle control, embedded motor systems, PWM control, home appliances, industrial equipment, WQFN20, HTSSOP28, motor tuning, non volatile memory, Hall sensor drive, low noise motor control

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

Samtec’s HSEC8 0.80 mm edge-card sockets use machined contacts to support high-speed, high-cycle modular systems.

Samtec, HSEC8, Generate series, edge card socket, 0.80 mm pitch, Edge Rate contact, high speed connector, signal integrity, modular systems, right angle connector, vertical connector, edge mount, power signal combo, PCB connector, datacom, telecom equipment, instrumentation, industrial electronics

EPC’s First Gen 7 eGaN FET Pushes Power Density in 40 V Designs

EPC’s new 40 V Gen 7 eGaN transistor offers low RDS(on) and reduced switching loss for compact, high efficiency power stages.

EPC, Efficient Power Conversion, EPC2366, GaN FET, eGaN transistor, Gen 7 GaN, 40 V FET, low RDSon, QG, synchronous rectification, DC DC conversion, AI servers, motor drives, power electronics, high density power, PQFN package

Toshiba CCD Sensor Boosts Line-Scan Speed For High-Precision Optical Inspection

Kontron mITX Board With Ryzen AI Embedded P100 Targets Real-Time Edge AI

Vishay Expands 0806 and 1210 Inductor Families With Smaller Footprints And Higher Thermal Headroom

Advantech i.MX 95 Modules Push Real-Time Edge AI Toward More Deterministic Control

Cree LED OptiLamp Pixels Bring Integrated Control To Modern Displays

Microchip Power Module Lifts AI Server Density With Vertical Architecture

RECOM High-Density DIN Rail Supply Widens Power Margin in Compact Panels

Toshiba Sine-Wave Controllers Sharpen Bldc Efficiency In Compact Drives

Samtec’s 0.80 mm Edge-Card Sockets Target High-Speed Modular Designs

EPC’s First Gen 7 eGaN FET Pushes Power Density in 40 V Designs

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