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Filtering by tag: "thermal management"
Clear tag filterMicrochip Power Module Lifts AI Server Density With Vertical Architecture
Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.
Read MoreToshiba’s TB9104FTG Streamlines Control Of High Current Automotive Motors
Toshiba’s TB9104FTG gate driver uses SPI control to reduce wiring and MCU load in high current automotive motor systems.
Read Moreonsemi Introduces Top Cool SiC Packaging for High Power Designs
onsemi adds a top cool T2PAK package to its EliteSiC MOSFETs, improving thermal performance and power density for EV and industrial designs.
Read MoreMelexis Launches Fourth-Generation LIN Motor Driver for EV Airflow Control
Melexis introduces the MLX81350, a 0.5 A LIN motor driver with sensorless FOC and ASIL B compliance for efficient, quiet EV HVAC and vent control.
Read MoreAdvanced Energy Expands Bus Converter Line with 1300 W and 1600 W Modules
Advanced Energy’s NDQ1300 and NDQ1600 deliver 48 V to 12 V conversion at 98% efficiency, built for AI servers, networking, and industrial systems.
Read MoreNOVOSENSE Launches NSD8389-Q1 Stepper Motor Driver with 1/256 Microstepping
Meta Description: NOVOSENSE’s NSD8389-Q1 delivers 1/256 microstepping, stall detection, and integrated protections for EV thermal management, lighting, and display systems.
Read MoreInfineon Expands OptiMOS 6 Portfolio with 150 V Automotive MOSFETs
Infineon’s OptiMOS 6 150 V MOSFETs deliver 2.5 mΩ RDS(on), low switching losses, and thermal resistance of 0.4 K/W, with TOLL, TOLG, and TOLT packaging for xEV designs.
Read MoreSK hynix Brings New Heat Dissipation Technology to Mobile DRAM
SK hynix begins shipping mobile DRAM with High-K EMC, improving thermal conductivity 3.5× and reducing resistance to tackle AI smartphone heat issues.
Read MoreNexperia Shrinks Power BJT Footprint with New CFP15B Packaging
Nexperia expands its BJT range with CFP15B-packaged MJPE devices, reducing footprint by 53% while maintaining thermal performance.
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