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Microchip Power Module Lifts AI Server Density With Vertical Architecture

Microchip’s MCPF1525 power module provides 25A per device, stackable to 200A, with PMBus control, low noise performance and a vertical package that improves board density for AI, HPC and PCIe based compute systems.

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Toshiba’s TB9104FTG Streamlines Control Of High Current Automotive Motors

Toshiba’s TB9104FTG gate driver uses SPI control to reduce wiring and MCU load in high current automotive motor systems.

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onsemi Introduces Top Cool SiC Packaging for High Power Designs

onsemi adds a top cool T2PAK package to its EliteSiC MOSFETs, improving thermal performance and power density for EV and industrial designs.

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Melexis Launches Fourth-Generation LIN Motor Driver for EV Airflow Control

Melexis introduces the MLX81350, a 0.5 A LIN motor driver with sensorless FOC and ASIL B compliance for efficient, quiet EV HVAC and vent control.

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Advanced Energy Expands Bus Converter Line with 1300 W and 1600 W Modules

Advanced Energy’s NDQ1300 and NDQ1600 deliver 48 V to 12 V conversion at 98% efficiency, built for AI servers, networking, and industrial systems.

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NOVOSENSE Launches NSD8389-Q1 Stepper Motor Driver with 1/256 Microstepping

Meta Description: NOVOSENSE’s NSD8389-Q1 delivers 1/256 microstepping, stall detection, and integrated protections for EV thermal management, lighting, and display systems.

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Infineon Expands OptiMOS 6 Portfolio with 150 V Automotive MOSFETs

Infineon’s OptiMOS 6 150 V MOSFETs deliver 2.5 mΩ RDS(on), low switching losses, and thermal resistance of 0.4 K/W, with TOLL, TOLG, and TOLT packaging for xEV designs.

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SK hynix Brings New Heat Dissipation Technology to Mobile DRAM

SK hynix begins shipping mobile DRAM with High-K EMC, improving thermal conductivity 3.5× and reducing resistance to tackle AI smartphone heat issues.

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Nexperia Shrinks Power BJT Footprint with New CFP15B Packaging

Nexperia expands its BJT range with CFP15B-packaged MJPE devices, reducing footprint by 53% while maintaining thermal performance.

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