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Navitas GeneSiC SiC MOSFETs Add QDPAK and Low-Profile TO-247

Navitas expands its 5th-generation GeneSiC silicon carbide MOSFET portfolio with top-side cooled QDPAK and low-profile TO-247-4L packages designed for AI data centers, grid infrastructure, and industrial power systems operating at 1200 V.

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Toshiba Photorelays Push Switching Reliability to 135°C

Toshiba introduces compact S-VSON4T photorelays rated for 135°C operation with integrated input resistors, designed for automated test equipment, probe cards, and burn-in systems.

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iDEAL Semiconductor SuperQ 200V MOSFETs Push RDS(on) Lower in Standard Packages

iDEAL Semiconductor introduces SuperQ 200 V MOSFETs delivering industry-low RDS(on) in TOLL and TO-220 packages. Devices target motor drives, SMPS, and high-current industrial power stages.

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US Blocks Chinese Chip Sales To Federal Government

In a move to try and improve US Federal Government cyber-security, the US is launching a new plan to ban Chinese chips in Federal systems. What challenges does China face, what will the plans do, and why is the current market not able to support such a ban?

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Synaptics SYN765x Brings Wi-Fi 7 and Edge AI to IoT Nodes

Synaptics introduces the SYN765x Wi-Fi 7 connectivity chip combining Bluetooth LE, Thread, and on-device AI processing. The device enables wireless sensing, Bluetooth channel sounding, and edge intelligence inside compact IoT systems.

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Texas Instruments TinyEngine NPU Pushes AI Into MCU Designs

Texas Instruments introduces MSPM0G5187 and AM13Ex microcontrollers integrating the TinyEngine NPU, enabling low-latency edge AI inference in embedded systems including motor control, wearables and industrial devices.

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STMicroelectronics ST64UWB Extends UWB Range for Secure Access

STMicroelectronics introduces the ST64UWB family supporting IEEE 802.15.4z and upcoming 802.15.4ab ultra-wideband standards with multi-millisecond ranging, improved link budget using 18 nm FD-SOI, and radar sensing capabilities for automotive and smart device applications.

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u-blox F11 GNSS Platform Balances Meter-Level Accuracy and Power

u-blox introduces the F11 GNSS platform supporting dual-band L1/L5 positioning with power consumption as low as 7 mW, targeting wearables, asset tracking, telematics and IoT devices.

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Researchers Develop New Semiconductor Defect Imaging Method

Researchers have developed a new imaging technique to identify semiconductor defects in cutting-edge wafers, a step towards error-free manufacturing for a high yield future.

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STMicroelectronics Scales Silicon Photonics for AI Interconnects

STMicroelectronics moves its PIC100 silicon photonics platform into high-volume 300 mm production for 800G and 1.6T optical interconnects supporting AI data center infrastructure.

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