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Filtering by tag: "advanced packaging"
Clear tag filterCould X-Ray Lithography Be The Key To Future Semiconductors
As extreme ultraviolet lithography approaches its physical limits, the semiconductor industry looks beyond EUV toward X-ray lithography and alternative scaling strategies, exposing the growing challenges of sub-nanometer manufacturing.
Read MorePowerLattice Develops Power Delivery Chiplet That Cuts Power by 50%
PowerLattice has emerged from stealth with a new power delivery chiplet designed for AI accelerators, GPUs, and CPUs, claiming over 50% power reduction. By integrating power delivery directly into the processor package using stacked chiplet design, on-die inductors, and software control, the approach could reshape high-performance, modular semiconductor systems.
Read MoreTI DLP Technology Pushes Maskless Lithography Toward Advanced Packaging
Texas Instruments’ DLP991UUV micromirror device delivers 8.9 MP resolution and sub-micron precision for advanced packaging and digital lithography.
Read MoreDeca and SST Partner to Advance NVM Chiplet Architectures
Deca and SST join forces to deliver modular NVM chiplets, combining Adaptive Patterning and SuperFlash technologies for advanced multi-die systems.
Read MoreRapidus Prototyping 2nm GAA Transistors
Are 2nm GAA transistors the final form of silicon innovation, or just the beginning? Explore how cutting-edge breakthroughs like 3D chip stacking, vertical transistor structures, and exotic 2D materials could reshape the future of computing far beyond what GAA alone can deliver.
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