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Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Infineon has introduced the FS01M9R13A7MA2B, a 1300 V HybridPACK Drive silicon carbide power module supporting continuous 205°C operation and up to 15% higher output current for EV traction inverters.

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Diodes Combines USB PD3.1 And Buck Control In Automotive USB-C IC

Diodes has introduced the APK43070Q, an automotive-qualified USB PD3.1 controller with integrated buck conversion, 140 W charging support, and intelligent power sharing across up to eight USB-C ports.

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Qorvo Expands RF Switching Portfolio With Wideband 10 GHz Family

Qorvo has introduced the QPC6144, QPC6122, and QPC6188 RF switches, delivering wideband operation from 50 MHz to 10 GHz with high isolation and simplified RF routing for 5G, industrial, drone, and test systems.

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TDK Adds Dual-Output 3D Hall Sensors For Motor Direction Detection

TDK has introduced the Micronas HAL 13xy family, a dual-output 3D Hall-effect switch sensor for automotive and industrial motor control with quadrature outputs, ASIL B readiness, and operation up to 170 °C.

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Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

Microchip has introduced 3.3 kV HV-D3 mSiC power modules for solid-state transformers, combining SiC MOSFETs, Schottky diodes, and high-voltage isolation for AI data centers and medium-voltage power systems.

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u-blox Adds Edge ML To ALMA-B2 Bluetooth LE Modules

u-blox has launched the ALMA-B2 wireless module series based on Nordic Semiconductor’s nRF54LM20 platform, combining Bluetooth LE 6.0, Thread, Zigbee, Channel Sounding, and Edge ML acceleration in compact IoT modules.

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ST Expands 700V PowerGaN Devices For AI And Robotics

STMicroelectronics has added seven 700V PowerGaN HEMTs to its STPOWER portfolio, targeting AI servers, robotics, industrial power systems, and high-density power conversion designs with current ratings up to 29 A.

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Samtec Expands Threaded SMPM RF Connectors For High-Vibration Systems

Samtec has expanded its SMPM Precision RF connector family with threaded cable-to-board mated sets for high-vibration military, aerospace, and communications systems, supporting frequencies up to 67 GHz.

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SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

SK hynix has introduced its iHBM thermal solution for next-generation HBM memory, embedding integrated cooling elements directly into the package to reduce thermal resistance by 30 percent in AI accelerator systems.

SK hynix, iHBM, HBM, HBM5, AI memory, high bandwidth memory, thermal management, AI accelerator, GPU memory, HPC, data center, semiconductor packaging, MR-MUF, wafer level packaging, memory cooling, D2D PHY, AI infrastructure, advanced packaging, memory technology

Murata Targets Direct ECU Integration With New 6DoF IMU

Murata has introduced the SCH1633-D05, a 6DoF inertial measurement unit designed for direct ADAS and automated driving ECU integration, combining high thermal stability, integrated EMC shielding, and factory calibration.

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Infineon Raises SiC Module Temperature Limit To 205°C For EV Inverters

Diodes Combines USB PD3.1 And Buck Control In Automotive USB-C IC

Qorvo Expands RF Switching Portfolio With Wideband 10 GHz Family

TDK Adds Dual-Output 3D Hall Sensors For Motor Direction Detection

Microchip Targets Solid-State Transformers With 3.3 kV SiC Modules

u-blox Adds Edge ML To ALMA-B2 Bluetooth LE Modules

ST Expands 700V PowerGaN Devices For AI And Robotics

Samtec Expands Threaded SMPM RF Connectors For High-Vibration Systems

SK hynix Targets HBM Thermal Bottlenecks With Integrated Cooling Structure

Murata Targets Direct ECU Integration With New 6DoF IMU

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